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Leading Memory Chip Manufacturer Plans to Launch Low-latency DDR4 Optimized for X750 and X299

A leading manufacturer of maximum efficiency memory and gaming peripherals, G-Skills, is revealing an all-new high-capacity, low-latency DDR4-3200 CL14-18-18-38 memory gear specification based on 32GB modules across the Trident Z RGB, Trident Z Royal, and Trident Z Neo series.

Available in 256GB, 128GB, and 64GB gear capacities for quad-channel and dual-channel platforms, these new DDR4 memory specs are built with the latest excessive-density 16Gb parts and supply the perfect combination of extreme efficiency and high memory capability.

DDR4-3200 CL14 has always been the sweet spot for performance since the early days of DDR4 memory, and G.SKILL is now bringing the legendary high-efficiency effectivity to the latest 32GB high-capability DDR4 modules.

Designed for the latest HEDT platforms with quad-channel support, the DDR4-3200 CL14-18-18-38 specification with 256GB memory gear capacity might be seen validated with the new Intel Core i9-10900X processor on the ASUS ROG RAMPAGE VI EXTREME ENCORE motherboard and the Intel Core i9-10940X processor on the MSI Creator X299 motherboard.

Optimized to extract every little bit of memory efficiency out of the newest 3rd Gen AMD Ryzen Threadripper platform, G.SKILL will also bring the low-latency DDR4-3200 CL14-18-18-38 256GB (32GBx8) specification to the AMD-compatible Trident Z Neo series.

This high-efficient gear is validated with the newest AMD Ryzen Threadripper 3960X processor on the ASUS ROG ZENITH II EXTREME motherboard.

Under the Trident Z Neo series, this new DDR4 memory specification may also be introduced onto the AMD X570 platform in gear capacities of 128GB (32GBx4) and 64GB (32GBx2).

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Michelle Campbell

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